Researchr is a web site for finding, collecting, sharing, and reviewing scientific publications, for researchers by researchers.
Sign up for an account to create a profile with publication list, tag and review your related work, and share bibliographies with your co-authors.
K. N. Tu. Reliability challenges in 3D IC packaging technology. Microelectronics Reliability, 51(3):517-523, 2011. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Reliability of micro-interconnects in 3D IC packagesC. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai. mr, 53(1):1, 2013. [doi]
The following publications are possibly variants of this publication: