Fengbin Tu, Yiqi Wang 0005, Zihan Wu 0006, Weiwei Wu, Leibo Liu, Yang Hu 0001, Shaojun Wei, Shouyi Yin. TensorCIM: A 28nm 3.7nJ/Gather and 8.3TFLOPS/W FP32 Digital-CIM Tensor Processor for MCM-CIM-Based Beyond-NN Acceleration. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 254-255, IEEE, 2023. [doi]
@inproceedings{TuWWWLHWY23a,
title = {TensorCIM: A 28nm 3.7nJ/Gather and 8.3TFLOPS/W FP32 Digital-CIM Tensor Processor for MCM-CIM-Based Beyond-NN Acceleration},
author = {Fengbin Tu and Yiqi Wang 0005 and Zihan Wu 0006 and Weiwei Wu and Leibo Liu and Yang Hu 0001 and Shaojun Wei and Shouyi Yin},
year = {2023},
doi = {10.1109/ISSCC42615.2023.10067285},
url = {https://doi.org/10.1109/ISSCC42615.2023.10067285},
researchr = {https://researchr.org/publication/TuWWWLHWY23a},
cites = {0},
citedby = {0},
pages = {254-255},
booktitle = {IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023},
publisher = {IEEE},
isbn = {978-1-6654-9016-0},
}