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Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface

Markus P. K. Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti. Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface. Microelectronics Reliability, 44(6):993-1007, 2004. [doi]

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Markus P. K. Turunen

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Pekka Marjamäki

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Matti Paajanen

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Jouko Lahtinen

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Jorma K. Kivilahti

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