Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface

Markus P. K. Turunen, Pekka Marjamäki, Matti Paajanen, Jouko Lahtinen, Jorma K. Kivilahti. Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface. Microelectronics Reliability, 44(6):993-1007, 2004. [doi]

Abstract

Abstract is missing.