Shinichiro Uemura, Yukio Hiraoka, Takayuki Kai, Shiro Dosho. Isolation Techniques Against Substrate Noise Coupling Utilizing Through Silicon Via (TSV) Process for RF/Mixed-Signal SoCs. J. Solid-State Circuits, 47(4):810-816, 2012. [doi]
@article{UemuraHKD12,
title = {Isolation Techniques Against Substrate Noise Coupling Utilizing Through Silicon Via (TSV) Process for RF/Mixed-Signal SoCs},
author = {Shinichiro Uemura and Yukio Hiraoka and Takayuki Kai and Shiro Dosho},
year = {2012},
doi = {10.1109/JSSC.2012.2185169},
url = {http://dx.doi.org/10.1109/JSSC.2012.2185169},
researchr = {https://researchr.org/publication/UemuraHKD12},
cites = {0},
citedby = {0},
journal = {J. Solid-State Circuits},
volume = {47},
number = {4},
pages = {810-816},
}