Test structure assembly for bump bond yield measurement on high density flip chip technologies

M. Ullán, M. Lozano, M. Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, R. Martínez, G. Pellegrini, C. Puigdengoles. Test structure assembly for bump bond yield measurement on high density flip chip technologies. Microelectronics Reliability, 46(7):1095-1100, 2006. [doi]

Abstract

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