Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne. Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectronics Reliability, 47(2-3):259-265, 2007. [doi]

Abstract

Abstract is missing.