Bart Vandevelde, Andrej Ivankovic, B. Debecker, M. Lofrano, Kris Vanstreels, W. Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Z. Tokei. Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectronics Reliability, 54(6-7):1200-1205, 2014. [doi]
Abstract is missing.