Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan De Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems. Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectronics Reliability, 74:131-135, 2017. [doi]
Abstract is missing.