Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components

Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan De Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems. Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectronics Reliability, 74:131-135, 2017. [doi]

Abstract

Abstract is missing.