Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs - researchr publication authors

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Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim. Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs. In Jens Lienig, Laleh Behjat, Stephen Yang, editors, ISPD '21: International Symposium on Physical Design, Virtual Event, USA, March 22-24, 2021. pages 39-46, ACM, 2021. [doi]

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