P. J. de Veen, C. Bos, D. R. Hoogstede, C. Th. A. Revenberg, J. Liljeholm, Thorbjorn Ebefors. High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications. Microelectronics Reliability, 55(9-10):1644-1648, 2015. [doi]
@article{VeenBHRLE15,
title = {High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications},
author = {P. J. de Veen and C. Bos and D. R. Hoogstede and C. Th. A. Revenberg and J. Liljeholm and Thorbjorn Ebefors},
year = {2015},
doi = {10.1016/j.microrel.2015.06.065},
url = {http://dx.doi.org/10.1016/j.microrel.2015.06.065},
researchr = {https://researchr.org/publication/VeenBHRLE15},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {55},
number = {9-10},
pages = {1644-1648},
}