High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications

P. J. de Veen, C. Bos, D. R. Hoogstede, C. Th. A. Revenberg, J. Liljeholm, Thorbjorn Ebefors. High-resolution X-ray computed tomography of through silicon vias for RF MEMS integrated passive device applications. Microelectronics Reliability, 55(9-10):1644-1648, 2015. [doi]

Abstract

Abstract is missing.