Madhava Sarma Vemuri, Umamaheswara Rao Tida. Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. In 63rd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2020, Springfield, MA, USA, August 9-12, 2020. pages 424-427, IEEE, 2020. [doi]
Abstract is missing.