Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration - researchr publication authors

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Madhava Sarma Vemuri, Umamaheswara Rao Tida. Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. In 24th International Symposium on Quality Electronic Design, ISQED 2023, San Francisco, CA, USA, April 5-7, 2023. pages 1-8, IEEE, 2023. [doi]

This author has not been identified. Look up 'Madhava Sarma Vemuri' in GoogleThis author has not been identified. Look up 'Umamaheswara Rao Tida' in Google

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