Marcus Miguel V. Vicedo, Febus Reidj G. Cruz, Ramon G. Garcia. Copper Coin Over Thermal VIA in PCB for Thermal Management of 12W. In 2020 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2020, Ha Long, Vietnam, December 8-10, 2020. pages 169-172, IEEE, 2020. [doi]
Abstract is missing.