Interconnect Challenges for 3D Multi-cores: From 3D Network-on-Chip to Cache Interconnects - researchr publication authors

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Pascal Vivet, Christian Bernard, Eric Guthmuller, Ivan Miro Panades, Yvain Thonnart, Fabien Clermidy. Interconnect Challenges for 3D Multi-cores: From 3D Network-on-Chip to Cache Interconnects. In 2015 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2015, Montpellier, France, July 8-10, 2015. pages 615-620, IEEE Computer Society, 2015. [doi]

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