Pascal Vivet, Christian Bernard, Eric Guthmuller, Ivan Miro Panades, Yvain Thonnart, Fabien Clermidy. Interconnect Challenges for 3D Multi-cores: From 3D Network-on-Chip to Cache Interconnects. In 2015 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2015, Montpellier, France, July 8-10, 2015. pages 615-620, IEEE Computer Society, 2015. [doi]
@inproceedings{VivetBGPTC15,
title = {Interconnect Challenges for 3D Multi-cores: From 3D Network-on-Chip to Cache Interconnects},
author = {Pascal Vivet and Christian Bernard and Eric Guthmuller and Ivan Miro Panades and Yvain Thonnart and Fabien Clermidy},
year = {2015},
doi = {10.1109/ISVLSI.2015.21},
url = {http://dx.doi.org/10.1109/ISVLSI.2015.21},
researchr = {https://researchr.org/publication/VivetBGPTC15},
cites = {0},
citedby = {0},
pages = {615-620},
booktitle = {2015 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2015, Montpellier, France, July 8-10, 2015},
publisher = {IEEE Computer Society},
isbn = {978-1-4799-8719-1},
}