Stress analyses of high spatial resolution on TSV and BEoL structures - researchr publication authors

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Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel. Stress analyses of high spatial resolution on TSV and BEoL structures. Microelectronics Reliability, 54(9-10):1963-1968, 2014. [doi]

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