Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel. Stress analyses of high spatial resolution on TSV and BEoL structures. Microelectronics Reliability, 54(9-10):1963-1968, 2014. [doi]
@article{VogelAABRZRM14,
title = {Stress analyses of high spatial resolution on TSV and BEoL structures},
author = {Dietmar Vogel and Ellen Auerswald and Jürgen Auersperg and Parisa Bayat and Raul D. Rodriguez and Dietrich R. T. Zahn and Sven Rzepka and Bernd Michel},
year = {2014},
doi = {10.1016/j.microrel.2014.07.098},
url = {http://dx.doi.org/10.1016/j.microrel.2014.07.098},
researchr = {https://researchr.org/publication/VogelAABRZRM14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {9-10},
pages = {1963-1968},
}