Sten Vollebregt, Ryoichi Ishihara, Johan van der Cingel, Kees Beenakker. Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits. In Mitsumasa Koyanagi, Morihiro Kada, editors, 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012. pages 1-4, IEEE, 2011. [doi]
@inproceedings{VollebregtICB11, title = {Low-temperature bottom-up integration of carbon nanotubes for vertical interconnects in monolithic 3D integrated circuits}, author = {Sten Vollebregt and Ryoichi Ishihara and Johan van der Cingel and Kees Beenakker}, year = {2011}, doi = {10.1109/3DIC.2012.6262989}, url = {http://dx.doi.org/10.1109/3DIC.2012.6262989}, researchr = {https://researchr.org/publication/VollebregtICB11}, cites = {0}, citedby = {0}, pages = {1-4}, booktitle = {2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31 - February 2, 2012}, editor = {Mitsumasa Koyanagi and Morihiro Kada}, publisher = {IEEE}, isbn = {978-1-4673-2189-1}, }