Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann. Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-5, IEEE, 2016. [doi]
@inproceedings{VosPPOMBKWWU16,
title = {Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects},
author = {Joeri De Vos and Lan Peng and Alain Phommahaxay and Joost Van Ongeval and Andy Miller and Eric Beyne and Florian Kurz and Thomas Wagenleiter and Markus Wimplinger and Thomas Uhrmann},
year = {2016},
doi = {10.1109/3DIC.2016.7970002},
url = {https://doi.org/10.1109/3DIC.2016.7970002},
researchr = {https://researchr.org/publication/VosPPOMBKWWU16},
cites = {0},
citedby = {0},
pages = {1-5},
booktitle = {2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016},
publisher = {IEEE},
isbn = {978-1-5090-1399-9},
}