J. W. C. de Vries, M. Y. Jansen, W. D. van Driel. On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. Microelectronics Reliability, 47(2-3):444-449, 2007. [doi]
@article{VriesJD07,
title = {On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections},
author = {J. W. C. de Vries and M. Y. Jansen and W. D. van Driel},
year = {2007},
doi = {10.1016/j.microrel.2006.05.009},
url = {http://dx.doi.org/10.1016/j.microrel.2006.05.009},
tags = {testing, C++, reliability},
researchr = {https://researchr.org/publication/VriesJD07},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {47},
number = {2-3},
pages = {444-449},
}