On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections

J. W. C. de Vries, M. Y. Jansen, W. D. van Driel. On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. Microelectronics Reliability, 47(2-3):444-449, 2007. [doi]

Abstract

Abstract is missing.