Analysis of thermal expansion in elastic and elastoplastic layers subjected to cyclic thermal loading

K. Wada, Y. Yagi, I. Nakagawa, T. Atsumi, N. Ohno. Analysis of thermal expansion in elastic and elastoplastic layers subjected to cyclic thermal loading. Microelectronics Reliability, 50(9-11):1626-1630, 2010. [doi]

Abstract

Abstract is missing.