Reduction of annealed-induced wafer defects in dual-damascene copper interconnects

Y. Abdul Wahab, A. F. Ahmad, H. Hussin, N. Soin. Reduction of annealed-induced wafer defects in dual-damascene copper interconnects. Microelectronics Reliability, 52(9-10):1975-1980, 2012. [doi]

Abstract

Abstract is missing.