Evaluation of 3DICs and fabrication of monolithic interlayer vias

William Wahby, Ashish Dembla, Muhannad Bakir. Evaluation of 3DICs and fabrication of monolithic interlayer vias. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]

Authors

William Wahby

This author has not been identified. Look up 'William Wahby' in Google

Ashish Dembla

This author has not been identified. Look up 'Ashish Dembla' in Google

Muhannad Bakir

This author has not been identified. Look up 'Muhannad Bakir' in Google