Efficient characterization of TSV-to-transistor noise coupling in 3D ICs

Hailang Wang, Mohammad H. Asgari, Emre Salman. Efficient characterization of TSV-to-transistor noise coupling in 3D ICs. In José Luis Ayala, Alex K. Jones, Patrick H. Madden, Ayse Kivilcim Coskun, editors, Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013. pages 71-76, ACM, 2013. [doi]

@inproceedings{WangAS13,
  title = {Efficient characterization of TSV-to-transistor noise coupling in 3D ICs},
  author = {Hailang Wang and Mohammad H. Asgari and Emre Salman},
  year = {2013},
  doi = {10.1145/2483028.2483064},
  url = {http://doi.acm.org/10.1145/2483028.2483064},
  researchr = {https://researchr.org/publication/WangAS13},
  cites = {0},
  citedby = {0},
  pages = {71-76},
  booktitle = {Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013},
  editor = {José Luis Ayala and Alex K. Jones and Patrick H. Madden and Ayse Kivilcim Coskun},
  publisher = {ACM},
  isbn = {978-1-4503-2032-0},
}