Testing of interposer-based 2.5D integrated circuits

Ran Wang, Krishnendu Chakrabarty. Testing of interposer-based 2.5D integrated circuits. In 2016 IEEE International Test Conference, ITC 2016, Fort Worth, TX, USA, November 15-17, 2016. pages 1-10, IEEE, 2016. [doi]

@inproceedings{WangC16-49,
  title = {Testing of interposer-based 2.5D integrated circuits},
  author = {Ran Wang and Krishnendu Chakrabarty},
  year = {2016},
  doi = {10.1109/TEST.2016.7805875},
  url = {http://dx.doi.org/10.1109/TEST.2016.7805875},
  researchr = {https://researchr.org/publication/WangC16-49},
  cites = {0},
  citedby = {0},
  pages = {1-10},
  booktitle = {2016 IEEE International Test Conference, ITC 2016, Fort Worth, TX, USA, November 15-17, 2016},
  publisher = {IEEE},
  isbn = {978-1-4673-8773-6},
}