Zefei Wang, Yi Chen, Chenlu Liu, Weiyang Lin, Liu Yang. Guided Reinforce Learning Through Spatial Residual Value for Online 3D Bin Packing. In 49th Annual Conference of the IEEE Industrial Electronics Society, IECON 2023, Singapore, October 16-19, 2023. pages 1-5, IEEE, 2023. [doi]
Abstract is missing.