Shuang Wang, Weiliang Chen, Xueqing Li, Leibo Liu, Huazhong Yang. A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by The Means of 2.5D Packaging Technology. In IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023. pages 1-3, IEEE, 2023. [doi]
@inproceedings{WangCLLY23-0,
title = {A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by The Means of 2.5D Packaging Technology},
author = {Shuang Wang and Weiliang Chen and Xueqing Li and Leibo Liu and Huazhong Yang},
year = {2023},
doi = {10.1109/A-SSCC58667.2023.10347909},
url = {https://doi.org/10.1109/A-SSCC58667.2023.10347909},
researchr = {https://researchr.org/publication/WangCLLY23-0},
cites = {0},
citedby = {0},
pages = {1-3},
booktitle = {IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023},
publisher = {IEEE},
isbn = {979-8-3503-3003-8},
}