Electro-thermal analysis of IGBT module from 3D CAD model

Hui Wang, Ding Gong, Chen Shen. Electro-thermal analysis of IGBT module from 3D CAD model. In International Conference on IC Design and Technology, ICICDT 2019, Suzhou, China, June 17-19, 2019. pages 1-5, IEEE, 2019. [doi]

Authors

Hui Wang

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Ding Gong

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Chen Shen

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