Electro-thermal analysis of IGBT module from 3D CAD model

Hui Wang, Ding Gong, Chen Shen. Electro-thermal analysis of IGBT module from 3D CAD model. In International Conference on IC Design and Technology, ICICDT 2019, Suzhou, China, June 17-19, 2019. pages 1-5, IEEE, 2019. [doi]

Abstract

Abstract is missing.