Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material - researchr publication authors

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Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen, Ming-Guan Chen, Chi-Chang Hu, Yu-Jie Chen, Ray-Hua Horng. Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material. Microelectronics Reliability, 63:68-75, 2016. [doi]

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