Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material

Tzu-Hao Wang, Hsuan Lee, Chih-Ming Chen, Ming-Guan Chen, Chi-Chang Hu, Yu-Jie Chen, Ray-Hua Horng. Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material. Microelectronics Reliability, 63:68-75, 2016. [doi]

Abstract

Abstract is missing.