A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect

Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao. A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectronics Reliability, 46(9-11):1673-1678, 2006. [doi]

Abstract

Abstract is missing.