SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging

Xi-Shu Wang, Xu-Dong Li, Huai-Hui Ren, Hai-Yan Zhao, Ryosuke Murai. SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging. Microelectronics Reliability, 51(8):1377-1384, 2011. [doi]

Abstract

Abstract is missing.