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Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

Fengjiang Wang, Dongyang Li, Shuang Tian, Zhijie Zhang, Jiheng Wang, Chao Yan. Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration. Microelectronics Reliability, 73:106-115, 2017. [doi]

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