A Novel Wafer-Level Packaging Solution For Mems

Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong. A Novel Wafer-Level Packaging Solution For Mems. International Journal of Computational Engineering Science, 4(2):339-342, 2003. [doi]

Abstract

Abstract is missing.