Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors

Hai Wang, Sheldon X.-D. Tan, Duo Li, Ashish Gupta 0007, Yuan Yuan. Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors. ACM Trans. Design Autom. Electr. Syst., 18(2):28, 2013. [doi]

Abstract

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