Ze Wang, Bo Tian, Wei Qiao, Liyan Qu. Real-Time Aging Monitoring for IGBT Modules Using Case Temperature. IEEE Transactions on Industrial Electronics, 63(2):1168-1178, 2016. [doi]
@article{WangTQQ16,
title = {Real-Time Aging Monitoring for IGBT Modules Using Case Temperature},
author = {Ze Wang and Bo Tian and Wei Qiao and Liyan Qu},
year = {2016},
doi = {10.1109/TIE.2015.2497665},
url = {http://dx.doi.org/10.1109/TIE.2015.2497665},
researchr = {https://researchr.org/publication/WangTQQ16},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Industrial Electronics},
volume = {63},
number = {2},
pages = {1168-1178},
}