Modeling and Simulation of Via-Connected Power Bus Stacks in Multilayer PCBs

Zhi Liang Wang, Osami Wada, Takashi Harada, Takahiro Yaguchi, Yoshitaka Toyota, Ryuji Koga. Modeling and Simulation of Via-Connected Power Bus Stacks in Multilayer PCBs. IEICE Transactions, 88-B(8):3176-3181, 2005. [doi]

Abstract

Abstract is missing.