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Zhi Liang Wang, Osami Wada, Takashi Harada, Takahiro Yaguchi, Yoshitaka Toyota, Ryuji Koga. Modeling and Simulation of Via-Connected Power Bus Stacks in Multilayer PCBs. IEICE Transactions, 88-B(8):3176-3181, 2005. [doi]
Abstract is missing.