A 28nm 386.5GOPS/W Coarse-Grained DSP Using Configurable Processing Elements for Always-on Computation with FPGA Implementation

Hedi Wang, Zengwei Wang, Yaolei Li, Chen Tang, Jinxu Gao, Huazhong Yang, Yongpan Liu. A 28nm 386.5GOPS/W Coarse-Grained DSP Using Configurable Processing Elements for Always-on Computation with FPGA Implementation. In IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023. pages 1-3, IEEE, 2023. [doi]

@inproceedings{WangWLTGYL23,
  title = {A 28nm 386.5GOPS/W Coarse-Grained DSP Using Configurable Processing Elements for Always-on Computation with FPGA Implementation},
  author = {Hedi Wang and Zengwei Wang and Yaolei Li and Chen Tang and Jinxu Gao and Huazhong Yang and Yongpan Liu},
  year = {2023},
  doi = {10.1109/A-SSCC58667.2023.10347929},
  url = {https://doi.org/10.1109/A-SSCC58667.2023.10347929},
  researchr = {https://researchr.org/publication/WangWLTGYL23},
  cites = {0},
  citedby = {0},
  pages = {1-3},
  booktitle = {IEEE Asian Solid-State Circuits Conference, A-SSCC 2023, Haikou, China, November 5-8, 2023},
  publisher = {IEEE},
  isbn = {979-8-3503-3003-8},
}