Huanpeng Wang, Jingrou Wang, Yuehang Xu. Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under Thermal Shock and Random Vibration. In 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, Nanjing, China, November 23-25, 2020. pages 100-101, IEEE, 2020. [doi]
@inproceedings{WangWX20-13,
title = {Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under Thermal Shock and Random Vibration},
author = {Huanpeng Wang and Jingrou Wang and Yuehang Xu},
year = {2020},
doi = {10.1109/ICTA50426.2020.9332071},
url = {https://doi.org/10.1109/ICTA50426.2020.9332071},
researchr = {https://researchr.org/publication/WangWX20-13},
cites = {0},
citedby = {0},
pages = {100-101},
booktitle = {2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, Nanjing, China, November 23-25, 2020},
publisher = {IEEE},
isbn = {978-1-7281-8032-8},
}