Huanpeng Wang, Jingrou Wang, Yuehang Xu. Reliability Design of a X-Band 2× 2 Tile-Type T/R Module under Thermal Shock and Random Vibration. In 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2020, Nanjing, China, November 23-25, 2020. pages 100-101, IEEE, 2020. [doi]
Abstract is missing.