Fengjuan Wang, Ningmei Yu. Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC). IEICE Electronic Express, 13(11):20151117, 2016. [doi]
@article{WangY16-13,
title = {Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC)},
author = {Fengjuan Wang and Ningmei Yu},
year = {2016},
url = {https://www.jstage.jst.go.jp/article/elex/13/11/13_13.20151117/_article},
researchr = {https://researchr.org/publication/WangY16-13},
cites = {0},
citedby = {0},
journal = {IEICE Electronic Express},
volume = {13},
number = {11},
pages = {20151117},
}