Fengjuan Wang, Ningmei Yu. Explicit model of thermal stress induced by annular through-silicon-via (TSV). IEICE Electronic Express, 13(21):20160767, 2016. [doi]
@article{WangY16a-1,
title = {Explicit model of thermal stress induced by annular through-silicon-via (TSV)},
author = {Fengjuan Wang and Ningmei Yu},
year = {2016},
doi = {10.1587/elex.13.20160767},
url = {http://dx.doi.org/10.1587/elex.13.20160767},
researchr = {https://researchr.org/publication/WangY16a-1},
cites = {0},
citedby = {0},
journal = {IEICE Electronic Express},
volume = {13},
number = {21},
pages = {20160767},
}