Zhangwei Wang, Haiwen Yuan, Jianxun Lv, Yingyi Liu, Hai Xu, Yingwei Zhang 0001. PCB Fault Identification With Multiscale Feature Fusion and Heat Source Attention Based on Multimodal Infrared Thermal Imaging. IEEE T. Instrumentation and Measurement, 74:1-13, 2025. [doi]
Abstract is missing.