Zhenjun Wang, Zhenxiang Yi, Run Tian, Ming Qin, Qing-An Huang, Zai-Fa Zhou, Kevin Long. Analysis and Compensation of Benchmark Drift of Micromachined Thermal Wind Sensor Caused by Packaging Asymmetry. IEEE Transactions on Industrial Electronics, 69(1):950-959, 2022. [doi]
@article{WangYTQHZL22,
title = {Analysis and Compensation of Benchmark Drift of Micromachined Thermal Wind Sensor Caused by Packaging Asymmetry},
author = {Zhenjun Wang and Zhenxiang Yi and Run Tian and Ming Qin and Qing-An Huang and Zai-Fa Zhou and Kevin Long},
year = {2022},
doi = {10.1109/TIE.2021.3050396},
url = {https://doi.org/10.1109/TIE.2021.3050396},
researchr = {https://researchr.org/publication/WangYTQHZL22},
cites = {0},
citedby = {0},
journal = {IEEE Transactions on Industrial Electronics},
volume = {69},
number = {1},
pages = {950-959},
}