Jia Wang, Hai Zhou. Interconnect estimation without packing via ACG floorplans. In Ting-Ao Tang, editor, Proceedings of the 2005 Conference on Asia South Pacific Design Automation, ASP-DAC 2005, Shanghai, China, January 18-21, 2005. pages 1152-1155, ACM Press, 2005. [doi]
@inproceedings{WangZ05:7,
title = {Interconnect estimation without packing via ACG floorplans},
author = {Jia Wang and Hai Zhou},
year = {2005},
doi = {10.1145/1120725.1120928},
url = {http://doi.acm.org/10.1145/1120725.1120928},
researchr = {https://researchr.org/publication/WangZ05%3A7},
cites = {0},
citedby = {0},
pages = {1152-1155},
booktitle = {Proceedings of the 2005 Conference on Asia South Pacific Design Automation, ASP-DAC 2005, Shanghai, China, January 18-21, 2005},
editor = {Ting-Ao Tang},
publisher = {ACM Press},
isbn = {0-7803-8737-6},
}