Degradation behavior and mechanism of polymer films for high-ohmic resistor protection in a heat and humid environment

X. Y. Wang, H. Zhang, X. P. Ma, Q. Cheng, C. G. Li, M.-X. Li, T. N. Chen, P. Zhang, J. Q. Shao. Degradation behavior and mechanism of polymer films for high-ohmic resistor protection in a heat and humid environment. Microelectronics Reliability, 57:79-85, 2016. [doi]

@article{WangZMCLLCZS16,
  title = {Degradation behavior and mechanism of polymer films for high-ohmic resistor protection in a heat and humid environment},
  author = {X. Y. Wang and H. Zhang and X. P. Ma and Q. Cheng and C. G. Li and M.-X. Li and T. N. Chen and P. Zhang and J. Q. Shao},
  year = {2016},
  doi = {10.1016/j.microrel.2015.12.005},
  url = {http://dx.doi.org/10.1016/j.microrel.2015.12.005},
  researchr = {https://researchr.org/publication/WangZMCLLCZS16},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {57},
  pages = {79-85},
}